[Mediapen=Cho Han-jin] Samsung Electronics will solidify its leading position in the memory market.

They announced support of the Samsung PM1733 PCle Gen4 Solid State Drive(SSD) and high density RDIMM and LRDIMM dynamic random access memory(DRAM) for the AMD EPYC 7002 Generation Processors.

The AMD EPYC 7002 Generation Processors are expected to deliver up to 2 times the performance per socket and up to 4 times peak FLOPS per socket than the previous generation. The new processors deliver a consistent, comprehensive set of I/O, memory and security features across 8-64 ‘Zen 2’ cores.

Samsung’s PCIe Gen 4-enabled PM1733 SSD will have double the throughput capabilities of current Gen 3 SSDs, giving it the highest performance of any SSD on the market. It reads sequentially at 8.0GB/s and randomly at 1500K IOPS, while offering capacities up to 30.72TB for U.2 (Gen 4 x4) configurations and 15.36TB for the HHHL (Gen 4 x8) form factor. The drive is produced with Gen5 512Gb TLC V-NAND.

The PM1733 drive will be available industry-wide this quarter in both U.2 and HHHL variants, and will be backward compatible with PCIe Gen 3 architectures, providing exceptional flexibility for existing and future server applications. The drive also features Dual Port capabilities to support storage as well as server applications.

In addition to Samsung’s PM1733 SSD, Samsung has provided its full lineup of RDIMM and LRDIMM DRAM products for AMD EPYC 7002 Series Processors. Using component architectures of 8GB and 16GB DDR4, Samsung is able to offer DIMM capacities ranging from 8GB to 256GB. With Samsung high density DIMMs, users can tap into as much as 4TB of memory per CPU.